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The thin film sensor’s principal advantage lies in its potential to take high frequency temperature measurements from the surface of a reentering spacecraft while simultaneously withstanding the high temperature and oxidizing environment encountered. This data provides engineers with operational phase measurements used to refine the spacecraft’s operational envelope and track flight hardware behavior in addition to providing high frequency temperature measurements that can inform the physics of a boundary layer. Mismatches in coefficients of thermal expansion (CTE) are expected in TPS-based sensor applications because the metallic materials used for temperature sensing have thermal expansion rates that differ from the rates of the substrate and coating materials in the TPS. At high temperatures during reentry, this mismatch in CTE can create a significant strain differential between the metallic sensor, sensor leads, and the materials to which the sensor and leads are bonded. High frequency response temperature measurements on the surface of entry spacecraft are not currently possible above ~700 F with existing measurement capabilities. This shortcoming is primarily due to the need for robust sensor behavior at temperatures of several thousand degrees F. The sensor design of this technology preserves the integrity of sensor components while enhancing its high temperature functionality. The thin film temperature sensor has a technology readiness level (TRL) 5 (Component and/or breadboard validation in relevant environment) and is now available for patent licensing. Please note that NASA does not manufacture products itself for commercial sale.

The advent of additive manufacturing makes available new and innovative integrated thermal management systems, including integrating an oscillating Heat Pipe (OHP) into the leading edge of a hypersonic vehicle for rapid dissipation of large quantities of heat. OHPs have interconnected capillary channels filled with a working fluid that forms a train of liquid plugs and vapor bubbles to facilitate rapid heat transfer. Multiple additive manufacturing techniques may be used, including powder bed fusion, binder jetting, metal material extrusion, directed energy deposit, sheet lamination, ultrasonic, and electrochemical techniques. These high performance OHPs can be made with materials such as Refractory High Entropy Alloys (RHEAs) that can withstand high temperature applications. The structure of the OHP can be integrated into the constructed leading edge. The benefits include a heat transport capacity of 10 to 100 times greater than before. Integrated OHPs avoid the bends or welds in traditional heat pipes, especially at the locations where the highest thermal stresses might cause thermal-structural failure of a leading edge. Alternating the diameters of the OHP channels alleviate start-up issues typically found in liquid metal oscillating heat pipe designs in high temperature applications by aiding in the instigation of a circulating flow due to multiple forces acting upon the working fluid.